Pulse and pulse reverse plating—Conceptual, advantages and applications
نویسندگان
چکیده
A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and lloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and orphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects nd mechanism. 2007 Elsevier Ltd. All rights reserved.
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